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<b><font color="#0033CC">Microscale Co., Ltd.</font></b> has been established
in Feb. 2000 with a purpose of deploying its advanced flip chip bumping services
to the worldwide semiconductor industry
<p><b><font color="#FF0000">Microscale’s</font></b> plant occupys a 4,950m2 area
with 1,650m2 of clean room (class100/10000) and has an output of 15,000 wafers
per month in 2001 and 50,000 wafers in 2003.</p>
<p><b><font color="#009933">Starting</font></b> with an Electro plating line for
Au bump, Microscale will set-up a stud bumping line, a solder bumping line,
and a PCB bumping line until 2001 to provide total bumping services to customers.</p>
<p><b><font color="#FF6600">As a customer</font></b>-driven business, Microscale
considers the customer’s satistaction as the most important thing and tries
to meet customer’s state-of-the-art needs by constant innovation and improvement
of flip chip technology. Our future- oriented technology, know-how and personal
commitment will meet the emerging needs for advanced packages</p>
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[ Selling Categories ]
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[ keyword ]
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Registration Date |
2002/07/29 (Year/Month/Date) |
Buyer / Seller in EC21 |
Seller |
Business Type |
Manufacturer |
Year established |
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Employees total |
11 - 50 |
Annual revenue |
USD 1,000,001 - 2,000,000 |
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Contact Information |
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Company |
Microscale Co., Ltd. |
Address |
1027-1 Yulbuk-Ri, Chungbuk-Myeon Pyongtaek-Si Gyeonggi-do 451-833 Korea |
Phone |
82 - 31 - 6801600 |
Fax |
82 - 31 - 6801797 |
Homepage |
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Contact |
Microscale
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