Au Stud Bump

In hand-held devices, flip chip bonding technology is preferred due to its high signal transfer rate and low N/S ratio. It has been reported that, among the various kinds of flip chip interconnection methods, Au-Au bonding with an Au stud bump using ultrasonic is the most suitable method. Because the interconnection of the flip chip using a stud bump does not required photolithography process and UBM, it can be a low-cost bumping process for low pin count devices. Au stud bumping can be applied on a finely patterned wafer (~80 mm). Microscale Co., Ltd will offer Au stud bumping service. Since flip chip package is different with conventional package in the viewpoint of electrical configuration, new types of ceramic package for hand-held devices should be developed. Microscale Co., Ltd also has been developing the new ceramic package in cooperation with Information and Communications University (Korea).

Bump Height : 35 um

Bump size : 80 um

Pitch : 150 um

Material : Au

UBM : N/A