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About Us
<b><font color="#0033CC">Microscale Co., Ltd.</font></b> has been established
in Feb. 2000 with a purpose of deploying its advanced flip chip bumping services
to the worldwide semiconductor industry
<p><b><font color="#FF0000">Microscale’s</font></b> plant occupys a 4,950m2 area
with 1,650m2 of clean room (class100/10000) and has an output of 15,000 wafers
per month in 2001 and 50,000 wafers in 2003.</p>
<p><b><font color="#009933">Starting</font></b> with an Electro plating line ...
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